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Motorola Gold Line
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Factory Code: n/a
Notes: The Gold Line Pen Pager is the first Motorola product to use the Direct Chip Attachment (DCA) process for placing and packaging its microprocessor, an integrated circuit chip (IC). Motorola's Gold Line Pen Pager began shipping March 1995.
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However, several specific challenges had to be overcome to achieve ship
acceptance. Motorola fulfilled its first major challenge when the DCA
Pen Module passed reliability requirements. One major issue arose during
biased temperature and humidity qualification testing. A vendor's DCA
solder bump fluxing process caused solder pad corrosion problems. The
corrosion issue was corrected by changing the vendor's DCA site reflow
process. Motorola solved DCA IC light sensitivity by protecting the DCA
IC from stimulating light. Broken waffle packer separation needles
initiated DCA IC cracks. The broken separation needles were replaced. A
periodic IC backside inspection procedure was then implemented to
monitor the waffle packing process. Inadequate vendor testing permitted
several bad DCA Printed Wire Boards (PWBs) to be marked good. The vendor
began a DCA site electrical opens test and improved their visual DCA
solder bump inspection process to address the testing problems. Motorola
confirmed DCA production readiness when the Gold Line Pen Pager
achieved ship acceptance in February 1995. This paper summarizes
solutions to the issues that arose during the implementation of the DCA
IC package on the Gold Line Pen Pager.
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